Package/System Design Solution Engineer, Senior

Emploi Taïwan

Titre du poste : Package/System Design Solution Engineer, Senior

Entreprise : Qualcomm

Description du poste : Job Description:Company: Qualcomm Semiconductor LimitedJob Area: Engineering Group, Engineering Group
Packaging EngineeringQualcomm Overview:Qualcomm is a company of inventors that unlocked 5G ushering in an age of rapid acceleration in connectivity and new possibilities that will transform industries, create jobs, and enrich lives. But this is just the beginning. It takes inventive minds with diverse skills, backgrounds, and cultures to transform 5Gs potential into world-changing technologies and products. This is the Invention Age – and this is where you come in.General Summary:The IC Package System Design Team at Qualcomm has an opening for a Senior Package/System Design Solution Engineer. The team is responsible for road mapping, architecting, design methodology, design implementation, and verification for all Qualcomm package products (Digital, RF, Analog, PMIC, etc.).Job Responsibilities

• Package selection, package design, and package electrical modeling.
• Optimizing system co-design of IC-PKG-PCB die with package footprint/height constraints, IC floor-planning, PCB, signal integrity, RF, power distribution network, and thermal constraints.
• Collaborating with cross-functional teams to ensure seamless integration of package designs with overall system requirements and performance goals.
• Utilizing 3D/2D EM simulation tools to analyze and optimize package designs for electrical performance and signal integrity.

Preferred Qualifications

• At least 3 years of experience in a similar role, with a focus on advanced packaging technologies such as flip-chip, wafer-level packaging, QFN and 3D integration.
• Proficiency in design tools such as Cadence, Mentor Graphics, or similar.
• Expertise in 3D/2D EM simulation tools for package design and analysis.
• Strong understanding of signal integrity, power integrity, and thermal management.
• Familiar with assembly and substrate manufacturing process
• Familiar with trade-offs among package cost, technologies, design, performance, power, and thermal requirements.
• Familiar with PCB stack-up and breakout strategy
• Effective communication skills to articulate complex technical concepts as a team player with solution prepared.

Educational Requirements

• Bachelor’s or Master’s degree in Electrical or Mechanical Engineering, Materials Science, or a related field.
• Master’s, Electrical Engineering is preferred.

Applicants: Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail or call Qualcomm’s toll-free number found . Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities.Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.To all Staffing and Recruiting Agencies: Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications.If you would like more information about this role, please contact .

Salaire attendu :

Localisation : Hsinchu City

Date du poste : Thu, 29 May 2025 05:50:58 GMT

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