Opportunité de Carrière : Leader Technique en Ingénierie Mécanique d’Emballage ASIC
Présentation de Cisco Systems
Cisco Systems, entreprise renommée dans le secteur technologique, se spécialise dans le développement de solutions permettant de gérer et de protéger les infrastructures numériques mondiales. Fort de quarante années d’innovation, Cisco recrute des experts pour rejoindre son équipe spécialisée dans la conception de dispositifs ASIC (Application-Specific Integrated Circuit) qui alimentent la majorité du trafic IP mondial.
Détails du Poste
Titre du poste : ASIC Package Mechanical Engineering Technical Leader
Localisation : Taipei City
Date de publication : 8 juillet 2025
Description de l’équipe
*Cisco Silicon One* opère au sein d’une organisation dédiée à la construction de circuits intégrés en silicium complexes à haute performance. L’équipe d’ASIC se compose d’experts dans la conception avancée de l’emballage IC (Integrated Circuit) et l’intégration de systèmes hétérogènes, en utilisant des technologies de pointe pour le transfert de signal et de données.
Votre Impact
Dans ce rôle stratégique, vous serez responsable des simulations mécaniques et thermomécaniques d’ASICs et de complexes systèmes d’emballage en silicium. Vos contributions seront essentielles pour assurer la fiabilité mécanique des produits, accélérer le design et réduire le temps de mise sur le marché.
Responsabilités Principales
- Effectuer des analyses par éléments finis (FEA) pour évaluer le stress thermomécanique, le gauchissement et la fiabilité des joints de soudure des emballages ASIC.
- Simuler et analyser les comportements des matériaux, incluant la plasticité et la viscoélasticité, pertinents aux joints de soudure et aux assemblages d’emballage avancés.
- Développer et automatiser des flux de simulation en utilisant Python, Fortran ou des outils similaires.
- Documenter et présenter les résultats d’analyse de manière claire et structurée pour soutenir les recommandations de design et l’analyse des causes profondes.
- Collaborer avec les équipes mondiales sur des projets à travers divers fuseaux horaires.
Qualifications Requises
Minimum Qualifications :
- Bachelor + 8 ans d’expérience ou Master + 6 ans d’expérience, ou PhD + 3 ans d’expérience.
- Expérience significative dans le design mécanique et la simulation thermomécanique des emballages de semi-conducteurs.
- Compétence avérée en modélisation 3D et analyses par éléments finis (utilisation d’ABAQUS ou ANSYS).
Qualifications Préférées
- 5+ ans d’expérience en simulation mécaniques des systèmes d’emballage électroniques.
- Connaissance des principes GD&T et DfR, ainsi que des normes industrielles (JEDEC, IPC, etc.).
- Familiarité avec l’intégration hétérogène et les technologies avancées d’emballage.
Pourquoi Choisir Cisco?
Cisco s’engage dans la transformation numérique, offrant des solutions qui garantissent sécurité et visibilité pour les organisations à l’ère de l’IA. L’entreprise favorise un environnement de travail collaboratif et inclusif, encourageant la croissance et l’innovation à l’échelle mondiale.
Informations Supplémentaires
Rémunération : La fourchette salariale est projetée pour les nouveaux employés à temps plein au sein des régions des États-Unis et du Canada, et comprend des primes annuelles. Les employés bénéficient également d’un large éventail d’assurances, de congés payés et d’opportunités de bénévolat.
Engagement Éthique
Cisco promeut un environnement de travail inclusif et équitable, se conformant à un code éthique strict. Les applicants sont encouragés à postuler sans distinction d’origine, de sexe ou de toute autre caractéristique personnelle.
Pour toute question concernant le processus de candidature ou les spécificités du poste, n’hésitez pas à contacter l’équipe des ressources humaines de Cisco.
📅 Date de publication de l’offre : Tue, 08 Jul 2025 22:07:21 GMT
🏢 Entreprise : Cisco Systems
📍 Lieu : Taipei City
💼 Intitulé du poste : ASIC Package Mechanical Engineering Technical Leader
💶 Rémunération proposée :
📝 Description du poste : Meet the TeamCisco Silicon One is a business organization with a long track record of building complex and high-performance Silicon ASICs. Our silicon devices drive the world’s most complex networks and carry over 90% of IP traffic. We are a highly specialized ASIC team with experts in all aspects of advanced IC package design and heterogeneous system integration. Our substrates use the latest 2.5D fanout technologies for large-scale integration, using the latest signaling and data transfer technologies.Your ImpactWe are seeking a skilled and driven ASIC Mechanical Engineer to join Cisco ASIC Group. In this role, you will focus on mechanical and thermomechanical simulations of ASICs and complex silicon packages. Your simulations will directly facilitate product design, ensure mechanical reliability, and accelerate time to market for high-performance Cisco Systems.You will:
- Perform finite element analysis to evaluate thermal mechanical stress, warpage, solder joint reliability of ASIC package, substrates, and advanced packaging assemblies
- Simulate and analyze linear/nonlinear material behaviors, such as plasticity, creep, and viscoelasticity, relevant to solder joints, Copper, stiffener, and underfills
- Develop and automate simulation workflows using Python, Fortran or similar scripting tools to streamline analysis and reporting
- Provide clear simulation results to support mechanical design, root cause analysis, and risk mitigation
- Support design optimization at early phase of product development and failure investigations by correlating FEA predictions with test data and field returns
- Document and present analysis results, assumptions, and design recommendations in a clear, structured format
Minimum Qualifications
- Bachelors + 8 years of related experience, or Masters + 6 years of related experience, or PhD + 3 years of related experience
- At least 3 years of experience in mechanical design and thermomechanical simulation of semiconductor packages
- Hands-on experience with 3D modeling, finite element analysis using ABAQUS or ANSYS
- Flexibility to coordinate and communicate across different time zones, supporting global project teams in the US and Asia
Preferred Qualifications
- 5+ years of experience in mechanical or thermomechanical simulation of semiconductors or electronics packaging systems
- Knowledge of GD&T, design-for-reliability (DfR) principles and industry standards (JEDEC, IPC, etc.)
- Experience in flip chips, 2.5D/3D advanced packaging, and/or heterogeneous integration technologies
- Familiarity with material mechanical behavior and material characterization and working knowledge of reliability qualification of semiconductor packages
- Proficiency in script-based automation for simulation to improve simulation efficiency and consistency
Why Cisco?At Cisco, we’re revolutionizing how data and infrastructure connect and protect organizations in the AI era – and beyond. We’ve been innovating fearlessly for 40 years to create solutions that power how humans and technology work together across the physical and digital worlds. These solutions provide customers with unparalleled security, visibility, and insights across the entire digital footprint. Simply put – we power the future.Fueled by the depth and breadth of our technology, we experiment and create meaningful solutions. Add to that our worldwide network of doers and experts, and you’ll see that the opportunities to grow and build are limitless. We work as a team, collaborating with empathy to make really big things happen on a global scale. Because our solutions are everywhere, our impact is everywhere.We are Cisco, and our power starts with you.Message to applicants applying to work in the U.S. and/or Canada:When available, the salary range posted for this position reflects the projected hiring range for new hire, full-time salaries in U.S. and/or Canada locations, not including equity or benefits. For non-sales roles the hiring ranges reflect base salary only; employees are also eligible to receive annual bonuses. Hiring ranges for sales positions include base and incentive compensation target. Individual pay is determined by the candidate’s hiring location and additional factors, including but not limited to skillset, experience, and relevant education, certifications, or training. Applicants may not be eligible for the full salary range based on their U.S. or Canada hiring location. The recruiter can share more details about compensation for the role in your location during the hiring process.U.S. employees have to quality medical, dental and vision insurance, a 401(k) plan with a Cisco matching contribution, short and long-term disability coverage, basic life insurance and numerous wellbeing offerings.Employees receive up to twelve paid holidays per calendar year, which includes one floating holiday (for non-exempt employees), plus a day off for their birthday. Non-Exempt new hires accrue up to 16 days of vacation time off each year, at a rate of 4.92 hours per pay period. Exempt new hires participate in Cisco’s flexible Vacation Time Off policy, which does not place a defined limit on how much vacation time eligible employees may use, but is subject to availability and some business limitations. All new hires are eligible for Sick Time Off subject to Cisco’s Sick Time Off Policy and will have eighty (80) hours of sick time off provided on their hire date and on January 1st of each year thereafter. Up to 80 hours of unused sick time will be carried forward from one calendar year to the next such that the maximum number of sick time hours an employee may have available is 160 hours. Employees in Illinois have a unique time off program designed specifically with local requirements in mind. All employees also have access to paid time away to deal with critical or emergency issues. We offer additional paid time to volunteer and give back to the community.Employees on sales plans earn performance-based incentive pay on top of their base salary, which is split between quota and non-quota components. For quota-based incentive pay, Cisco typically pays as follows:.75% of incentive target for each 1% of revenue attainment up to 50% of quota;1.5% of incentive target for each 1% of attainment between 50% and 75%;1% of incentive target for each 1% of attainment between 75% and 100%; and once performance exceeds 100% attainment, incentive rates are at or above 1% for each 1% of attainment with no cap on incentive compensation.For non-quota-based sales performance elements such as strategic sales objectives, Cisco may pay up to 125% of target. Cisco sales plans do not have a minimum threshold of performance for sales incentive compensation to be paid.
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